LSM6DSV16BX breakout

A 28 × 25.4 mm two-layer board for hand assembly and testing of the LSM6DSV16BX. I²C/SPI, interrupts, TDM contact audio and Qvar pins are accessible. All components are on the front, with 0402 passives and ordinary 2.54 mm headers.

The schematic and PCB have passed their recorded software checks. Fine-pitch mask-dam acceptance, hand assembly and bench operation remain open. Qvar header pins are grounded by fitted zero-ohm links until those links are removed.

See the assembly, pinout and fabrication guide.

Schematics and assembly

• Schematic PDF — includes hierarchical sheets.
• Interactive BOM and board inspector.
• Component BOM (CSV).
• Exact saved PCB snapshot.

These are development documentation exports. The BOM is not a supplier upload file. Manufacturing packages and supplier acceptance are tracked by the board's build recipe.

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Snapshot 2b1de97c7599 · Build manifest.